ACME SYSTEM TECHNOLOGIES CORP.

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2008/0002,970 Solderable compact camera module and method of manufacture thereofAbandonedJul 03, 06Jan 03, 08[G03D]
2007/0145,254 Packaging method for an assembly of image-sensing chip and circuit boardAbandonedDec 28, 05Jun 28, 07[H01J]
2007/0145,506 Assembly of image-sensing chip and circuit board with inward wire bondingAbandonedDec 28, 05Jun 28, 07[H01L]
2007/0120,213 Wire under dam package and method for packaging image-sensorAbandonedNov 28, 05May 31, 07[H01L]
2007/0120,291 Method for forming lugs of micro-SDAbandonedNov 28, 05May 31, 07[B29C]

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